Capabilities

Specific equipment, tolerances, materials, and certifications — the technical reference for engineers and procurement teams evaluating Peakingtech for a manufacturing project.

Home › About › Capabilities

Capabilities

Team

IPC-A-610 Class 2 | ISO 9001 | Shenzhen-based

TECHNICAL REFERENCE

PCBA ASSEMBLY

Electronics manufacturing specifications

IPC-A-610 Class 2 standard across all builds. NPI from 5 units, production from 50 units. All specifications below are for standard commercial electronics — Class 3 high-reliability specifications available on request.

SMT Assembly

Parameter Specification

Minimum component size 01005 (0.4mm ×0.2mm)

Maximum board size 460mm × 460mm

Minimum board size 50mm × 50mm

PCB thickness range 0.4mm – 3.2mm

Maximum panel size 510mm × 460mm

Placement accuracy ±0.05mm (3σ)

BGA minimum pitch 0.3mm

BGA ball count No defined maximum

QFN minimum pitch 0.4mm

Supported lead-free alloys SAC305, SAC405, SnBi

Leaded process Yes (RoHS)

Dual-sided SMT Yes — top and bottom

Mixed SMT/through-hole Yes

SMT shop
SMT shop

Through-Hole Assembly

through-hole assembly production line
through-hole assembly production line

Parameter Specification

Manual through-hole Yes — all builds

Selective solder Yes

Wave solder Yes(w/ masking)

Press-fit connectors Yes

Mixed SMT and through-hole Yes — standard

Special Processes

Conforming coating for PCBA
Conforming coating for PCBA

Parameter Specification

Underfill (capillary flow) Yes

Conformal coating Yes

Selective conformal coating Yes

Potting and encapsulation Yes

Staking and adhesive bonding Yes

RF shielding can installation Yes

Heat sink attachment Yes

Battery connection (JST/Molex) Yes

Parameter Specification

In-circuit programming Yes(JTAG, SWD, UART, SPI)

Programming interfaces Custom pogo-pin fixtures

OTA (over-the-air) firmware Yes

Firmware version control Yes

Production programming verification Yes

Secure boot firmware loading Yes

Firmware and Programming on PCBA
Firmware and Programming on PCBA

Firmware and Programming

Inspection

PCBA AOI
PCBA AOI

Parameter Specification

Automated Optical Inspection (AOI) All

AOI detection capability Placement errors, etc.

X-ray inspection Standard for BGA and QFN

X-ray system 2D and CT (3D cross-section)

Manual inspection standard IPC-A-610 Class 2

Solder joint inspection IPC-A-610 Class 2

First article inspection Yes

Incoming component inspection All ICs

Counterfeit detection Certificate of conformance

Parameter Specification

Functional test — bench Available all quantities

Functional test — fixture Available for large runs

Test fixture design Pogo-pin bed-of-nails

Test coverage Per approved specification

In-circuit test (ICT) Available

Flying probe test Available for small volume

Test cycle time (fixture) 30–120s per unit

Test result logging Per-unit pass/fail with SN

Environmental stress screening Burn-in

Electronics testing
Electronics testing

Testing

Parameter Specification

Build traveler All builds

AOI report All SMT builds

X-ray inspection images All BGA/QFN builds

IPC-A-610 inspection report All builds

First article photographs All builds

Rework log (IPC-7711) All builds requiring rework

Documentation package All production runs

Component traceability All production runs

Certificate of conformance Available on request

Quality documentation
Quality documentation

Quality documentation

IPC-A-610 Rev G — Acceptability of Electronic Assemblies (Class 2, Class 3 on request)

IPC-J-STD-001 — Requirements for Soldering Electrical and Electronic Assemblies

IPC-7711/7721 — Rework, Modification and Repair of Electronic Assemblies

IPC-1752A — Materials Declaration Management

IPC-9252A — Requirements for Electrical Testing of Unpopulated and Populated PCBs

RoHS Directive 2011/65/EU — Restriction of Hazardous Substances (all builds compliant by default)

ISO 9001:2015 — Quality Management Systems

STANDARDS AND CERTIFICATIONS
STANDARDS AND CERTIFICATIONS

Standards & Certifications

INJECTION MOLDING

Plastic enclosure and molding specifications

Aluminum rapid tooling for prototype stage, P20 and H13 steel for production. All tooling is client-owned from the moment it is paid for. Tolerances and material properties below are for standard commercial enclosure applications.

Tooling options and key specifications

Multi-cavity tooling (2, 4, or 8+ cavities) reduces per-part cost at higher production volumes by producing multiple parts per machine cycle. Cavity count decision depends on annual production volume, part complexity, and tooling budget. Multi-cavity tooling is designed and quoted on a per-project basis.

plastic injection mold
plastic injection mold

Aluminum

TOOL LIFE: 5,000-10,000 shots

LEAD TIME: 2-3 weeks

COST RANGE: $1,500-$3,000

USE: Design validation, prototype builds

CAVITY OPTIONS: Single cavity standard

SURFACE FINISH: Up to SPI B2

MATERIAL: Most thermoplastics

P20 Steel

TOOL LIFE: 300,000–500,000 shots

LEAD TIME: 4-5 weeks

COST RANGE: $3,000-$8,000

USE: Most production runs

CAVITY OPTIONS: 1, 2, 4 cavities

SURFACE FINISH: Up to SPI A2

MATERIAL: All thermoplastics

H13 Steel

TOOL LIFE: 500,000–1,000,000+ shots

LEAD TIME: 5-7 weeks

COST RANGE: $8,000-$20,000+

USE: High-volume, abrasive materials

CAVITY OPTIONS: 1, 2, 4, 8+ cavities

SURFACE FINISH: Up to SPI A1

MATERIAL: All including abrasive/filled materials

Tooling dimensional specifications

Maximum part size: 400mm × 300mm × 200mm (L × W × H)

Minimum wall thickness: 0.8mm (material-dependent)

Typical tolerance — P20 steel: ±0.1mm on critical dimensions

Typical tolerance — aluminum: ±0.15mm on critical dimensions

Minimum draft angle: 0.5° per surface (1° recommended)

Undercut capability: Side actions, lifters, collapsible cores

Gate types: Edge, sub, pin, hot runner (project-dependent)

Runner system: Cold runner standard, hot runner available

IP rating design: Gasket groove design for IP54–IP68

Material specifications

ABS: easy to mold, good surface quality, paintable, and cost-effective

PC: Preferred when high impact resistance or elevated temperature performance is required

ABS+PC blend: For mid/high-end consumer electronics enclosures - both aesthetics and durability

PP: For enclosures used in chemical, food, or hygiene environments, also used for living hinges

PA/Nylon (PA6, PA66): Applications requiring high mechanical strength, temperature resistance

POM (Acetal/Delrin): High-precision mechanical components requiring tight dimensional tolerance

TPE/TPU: Overmolding onto rigid substrates (ABS/PC) for soft-touch grip surfaces, seals, gaskets

PMMA (Acrylic): Display windows, light pipes, decorative panels for optical clarity/transparency

PC Clear: Transparent panels, lenses, windows for both optical clarity and impact resistance

Mold surface finishes

A1: Mirror polish (diamond, 3µm)

A2: High gloss (diamond, 6µm)

A3: Standard gloss (diamond, 15µm)

B1: Smooth matte (paper, 400 grit)

B2: Matte (paper, 320 grit)

B3: Dull matte (paper, 240 grit)

C1: Fine texture (stone, 600 grit)

C2: Medium texture (stone, 400 grit)

C3: Rough texture (stone, 320 grit)

D1: Blasted (glass bead)

D2: Blasted (dry blast)

D3: Blasted (rough blast)

VDI 12–42 range available on request

Secondary operations

Painting: Single color, multi-color with masking

Spray coating: UV-resistant topcoat, soft-touch coating, rubber-feel coating

Pad printing: Up to 4 colors, repeat registration ±0.1mm

Screen printing: Flat and slightly curved surfaces

UV printing: Full-color photographic quality — flat surfaces

Laser engraving: Permanent, precise — logos, labels, serial numbers

Hot stamping: Metallic foil decoration

Chrome plating: ABS substrate (requires conductive base coat)

Color matching: Pantone, RAL — standard and custom

Assembly: Sub-assembly and full box-build available

Insert molding: Brass inserts, threaded inserts, metal reinforcements

Overmolding: TPE/TPU over rigid substrate, same-shot/secondary molding

IP rating design

Enclosures designed for IP54, IP65, IP66, and IP67 ratings. IP rating design is a Chapter 1 DFM consideration — gasket groove geometry, wall flatness specification, and seal material must be determined at the design stage, not retrofitted after tooling is committed. IP68 design available on request. Tested IP rating certification support (producing test samples) is available for FCC/CE-registered test labs.

Complex plastic injection mold
Complex plastic injection mold

METAL FABRICATION

Metal parts and enclosure specifications

Three metal fabrication processes — sheet metal, CNC machining, and die casting — each with different tolerance capabilities, volume economics, and design requirements. Prototypes from 1 piece across all metal processes.

Sheet Metal

Enclosure panels, brackets, chassis, and structural parts. Flat-to-3D geometry using cutting and bending. Best for thin-wall parts (0.5–3mm) requiring consistent geometry and surface area.

Volume economics:
Prototypes from 1 piece. Production from 10+ pieces. Cost per part decreases with quantity but not dramatically — no tooling amortization barrier.

Laser cut Bend Weld Hardware

SHEET METAL SPECIFICATIONS

  • Minimum sheet thickness: 0.5mm

  • Maximum sheet thickness: 6mm (standard), 12mm (special request)

  • Maximum sheet size: 2,000mm × 1,000mm

  • Minimum bend radius: 0.5× material thickness

  • Minimum flange height: 3× material thickness

  • Minimum hole diameter: Equal to material thickness

  • Minimum hole-to-edge: 2× material thickness

  • Laser cut tolerance: ±0.1mm

  • Formed dimension tolerance: ±0.2mm

  • Angular tolerance: ±0.5° per bend

  • Maximum part size (formed): 1,200mm × 600mm × 500mm

  • Welding: TIG, MIG, spot — all available

  • Hardware insertion: PEM nuts, standoffs, studs — all available

  • Minimum prototype quantity: 1 piece

  • Standard production MOQ: 10 pieces

Precision parts requiring tight tolerances, complex 3D geometry, or material properties unavailable in sheet metal. Housings, heatsinks, brackets with machined features, custom mechanical interfaces.

Volume economics:
Prototypes from 1 piece. Economical at 1–500 pieces. Unit cost decreases slowly with volume — no step-change. High per-unit cost at very high volumes (die casting typically preferred above 1,000+ complex parts).

3-axis 5-axis Turning Precision

SHEET METAL SPECIFICATIONS

  • Maximum size: 600 × 500 × 400mm (milling)

  • Minimum feature size: 0.5mm (end mill dia.)

  • Standard tolerance: ±0.025mm

  • Precision tolerance: ±0.010mm

  • Flatness: ±0.02mm/100mm

  • Parallelism: ±0.02mm

  • Perpendicularity: ±0.05mm

  • Surface roughness — standard: Ra 1.6µm

  • Surface roughness — fine: Ra 0.8µm

  • Axis capability: 3-axis standard, 5-axis available

  • Turning/lathe: Yes — cylindrical parts/features

  • Thread tapping: Yes — metric and imperial

  • Minimum prototype quantity: 1 piece

  • Standard production MOQ: 1 piece (no MOQ)

  • Typical lead time — prototype: 5–7 days

  • Typical lead time — production: 10–15 days

CNC Machining

High-volume metal parts requiring complex geometry with consistent wall thickness — aluminum or zinc alloy housing shells, connector bodies, structural components. Combines injection-molding-like complexity with metal properties.

Volume economics:
Tooling required (higher one-time cost than injection mold). Economical above 1,000–2,000 pieces. Unit cost well below CNC at high volume. Not suitable for low-volume or prototype applications.

Aluminum alloy Zinc alloy High volume Complex geometry

SHEET METAL SPECIFICATIONS

  • Processes: High-pressure die casting (HPDC)

  • Maximum part size: 400mm × 300mm × 200mm

  • Maximum part weight: 3kg

  • Minimum wall thickness: 0.8mm (Zn)

  • Standard tolerance: ±0.15mm

  • Surface roughness: Ra 1.6–3.2µm (as-cast)

  • Draft angle: 1–2° internal, 0.5–1° external

  • Post-machining: Available — for tight-tolerance

  • Minimum production quantity: 1,000 pieces

  • Tooling cost range: $5,000–$25,000 per cavity

  • Tooling lead time: 4–6 weeks

  • Unit cost range: Varies significantly by complexity — quoted per project

Die Casting

progressive stamping die
progressive stamping die

COMPONENT SOURCING

Sourcing and supply chain capabilities

Authorized distributors only — no open market, no grey market, no exceptions. BOM management from initial quote through ongoing production cycles, with continuous lead time monitoring and supply risk alerting.

Authorized distributors only - every BOM line

Every component in every BOM is sourced from authorized distributors in the franchised distribution chain. Peakingtech does not purchase from broker networks, trading companies, or spot market platforms regardless of pricing or availability pressure. When authorized stock is unavailable at acceptable lead time, the response is alternative component qualification — not open market sourcing.

DISTRIBUTOR NETWORK

PRIMARY AUTHORIZED DISTRIBUTORS

  • Digi-key

  • Mouser Electronics

  • Arrow Electronics

  • Avent

  • Future Electronics

  • RS Components

Certificate of conformance required from all suppliers for ICs and active components. Documentation retained and available to client on request.

INCOMING INSPECTION PROTOCOL

  • Certificate of conformance verification

  • Lot code and date code recording

  • Visual inspection

  • Physical verification

  • Functional spot-check

Counterfeit electronic components — particularly integrated circuits — are a real and persistent supply chain risk that has affected products from every tier of the electronics industry. The risk is highest for components sourced outside the authorized distribution chain, which is why Peakingtech's no-open-market policy is the most important single counterfeit prevention measure. For authorized distributor stock, the incoming inspection protocol provides a second verification layer.

Multi-layer counterfeit detection at incoming inspection

COUNTERFEIT PREVENTION

verification
verification

SERVICES INCLUDED

  • Initial BOM sourcing: Full BOM quoted from Gerber/BOM files

  • Lead time analysis: Line-by-line lead time analysis at each production cycle

  • Alternative qualification: Authorized alternates qualified for single-source components and long-lead risk mitigation

  • BOM cost optimization: Volume pricing evaluation, alternative component evaluation for cost reduction

  • Discontinuation monitoring: Active monitoring for EOL (end-of-life) and NRND (not recommended for new designs) notices

  • Last-time buy coordination: Coordination of last-time buy quantities for discontinued components

  • BOM revision management: Design change order support — revised BOM managed per engineering change order

  • Cross-reference: Cross-reference to verified alternatives for obsolete or unavailable components

BOM management covers the complete component supply lifecycle — from initial BOM review against design files through ongoing availability and pricing monitoring across production cycles. The service is integrated with the production planning cycle rather than treated as a one-time procurement activity.

Complete BOM management from design through ongoing production

BOM MANAGEMENT

BOM management
BOM management

ONGOING ACTIVITIES

  1. Lead time monitoring: Component lead time changes monitored continuously. Client alerted when lead time increase affects production schedule or reorder point calculation.

  2. Safety stock planning: Reorder parameters — MOQ, safety stock, reorder point — established at production start and updated as actual demand data replaces forecast.

  3. Supply risk alerting: Single-source components, allocation notices, and supply disruption signals monitored. Alternative qualification initiated proactively when risk is identified.

  4. Supply chain event log: Any supply chain event — price spike, allocation, lead time change, quality incident — documented and shared with client. Builds supply chain intelligence across production cycles.

Ongoing supply chain management is the difference between a manufacturing partner and a manufacturing service. A service executes production orders. A partner monitors the supply chain between orders, alerts to risks before they become crises, and adjusts reorder parameters as demand patterns evolve.

Supply chain management across production cycles

supply chain icon
supply chain icon

ONGOING SUPPLY CHAIN

CERTIFICATIONS & QUALITY

Quality standards and certifications

All certifications and quality standards that apply across Peakingtech's manufacturing services — consolidated for procurement evaluation and supplier qualification.

Manufacturing Standards

IPC-A-610 Rev G
Acceptability of Electronic Assemblies
Scope: Class 2 standard across all builds — Class 3 available on request

IPC-J-STD-001 Rev H
Requirements for Soldering Electrical and Electronic Assemblies
Scope: Lead-free (primary) and leaded processes

IPC-7711/7721 Rev D
Rework, Modification and Repair of Electronic Assemblies
Scope: All rework performed to this standard — rework log maintained per build

IPC-1752A
Materials Declaration Management
Scope: Component lot and date code traceability — batch and unit level

IPC-9252A
Requirements for Electrical Testing of Unpopulated and Populated PCBs
Scope: Functional and in-circuit test per this standard

ISO 9001:2015
Quality Management Systems — Requirements
Scope: Quality management system certification — applies across all manufacturing services

RoHS Directive 2011/65/EU (as amended)
Restriction of Hazardous Substances in Electrical and Electronic Equipment
Scope: All builds compliant by default — documentation available on request

AQL Statistical Sampling: ISO 2859-1

Levels agreed per product at production planning. Higher-reliability applications may specify tighter levels.

First-Pass Yield Monitoring

Per-batch tracking — IPC-7711 rework

≥ 95% FPY target — consumer electronics
≥ 98% FPY target — high-reliability

Yield threshold agreed per product. Below-threshold batch triggers investigation before next batch.

Component Traceability: IPC-1752A
Batch-level, Unit-level

Lot codes, date codes, and firmware version recorded per build. 3-year minimum retention.

Production Functional Testing: IPC-9252A
Fixture-based: 30–120 seconds/unit (200+ units)
Bench: all quantities

Test specification approved by client before production begins.

Quality system

Peakingtech produces certification test samples to full production standard and maintains BOM configuration lock for certified product configurations, ready for certification testing by accredited third-party test laboratories.

FCC Part 15 / Part 18 — United States
Intentional/unintentional radiators — consumer and commercial electronics

CE Marking — European Union
Radio Equipment Directive (RED), EMC Directive, Low Voltage Directive

UKCA — United Kingdom
Post-Brexit equivalent of CE — same technical requirements

RCM — Australia / New Zealand
Regulatory Compliance Mark — electrical safety, EMC

KC — South Korea
Korea Certification — radio and electrical safety

CCC — China
China Compulsory Certification — required for China market sales

TELEC — Japan
Technical Conformity Mark — radio frequency equipment

SRRC — China (radio)
State Radio Regulation of China — wireless product radio type approval

UL Listing — United States
UL safety certification — on request, extended timeline

Product Certification Support

Have a specific manufacturing requirement?

Share your design files or project requirements — we'll confirm specific capability fit and provide indicative pricing within 48 hours. NDA executed before any file review.

TECHNICAL INQUIRY

NDA before file review · Capability confirmation within 48 hours · No commitment required